旭崇 FOG-FOB邦定设备 XCH77-A5

 龙虎大战平台    |      2019-08-18 20:22:45
旭崇 FOG/FOB邦定设备 XCH77-A5

旭崇 FOG/FOB邦定设备 XCH71-A6

FOG/FOB Bonding M/C


本产品适用于各种液晶屏(LCD PANEL)、触摸功能玻璃(SENSOR GLASS)、硬质线路板(PCB、PCBA)与柔性线路板(FPC、COF、TAB)在FOG、FOB工艺中的热压邦定。 The machine is used for bonding all kinds of FPC, COF, TAB and liquid crystal screen panel (LCD PANEL), SENSOR GLASS, PCB, and PCBA in FOG, FOB process.

 

人机操作界面:  Operating Interface

FPC工作平台X-y-θ调节机构:  Micrometer adjuster

温度控制系统:   Temperature controlling System

视频分割器:  Video segmentation

LED光源控制器:  LED light controller

X-Y-θ压头调节机构:  Adjusting group of pressure head

CCD对位机构:  CCD aligning group  

X-Y轴机构:  Group of X-Y Moving Axis

 

 

产品介绍

1.设备开机复位完成。2.Panel放于工作台上,打开真空吸附牢固。3.FPC放在FPC夹具上,打开FPC真空吸附牢固。4.翻转FPC夹具,手动调节X-Y--θ进行对位。5.按下双启动按钮,下压,邦定。6.邦定完之后平台自动运行到下一个邦定位进行邦定工作。 

1. Start and reset machine.

2. Put panel on platform; turn on vacuum of platform to attach it.

3. Place FPC on fixture, turn on vacuum button to attach it.

4. Overturn FPC fixture manually and adjust micrometer adjuster to align with panel.

5. Press double start button, platform moves to bonding position, pressure head goes down to bond.

6. Bonding finished, platform moves to next bonding position (can set multi-station bonding). 


参数

输入电源:380V 50-60HZ

Input power: 380V 50-60HZ

额定功率:4.5KW

Rated power: 4.5KW

工作气压:0.6Mpa

Working pressure: 0.6 Mpa

软胶头尺寸:L430*W305*H10mm(可订做)

Size of Pressure Head: L430* W305*H10mm (can be customized)

安全防护:静电防护+光栅保护+漏电保护

Safety Protection: ESD protection + grating protection + leakage protection

压头机构:气缸

Group of Pressure Head:  Controlling by cylinder

LCD载台:进出电机驱动

LCD Platform: Driven by motor

程序控制:松下PLC

Controlling System:  Panasonic PLC

外型尺寸:L850*W1000*H1750mm(不含FFU

Dimension: L850*W1000*H1750mm (exclude alarm lamp)

设备重量:750KG

Weight of Machine: 750KG

 

 

功能特点

1.人机操作界面:便捷设定和显示各项参数;如平台进出速度,贴合时间,真空值。

2FPC工作平台X-Y-θ调节机构:X-Y-θ千分尺调节夹具组,真空吸咐,达到快速定位,提高效率。

3.温度控制系统:等比例分切、多温区控制、精准通讯,确保温度精准性。

4.视频分割器:能满足不同放大倍率的产品成像。

5.LED光源控制器:可根据需求调整,适合各种物体清晰成像。

6.X-Y-θ压头调节机构:调节方便。压头水平度高;自动卷皮轮,邦定完成可自动卷动热压皮,频率及长度均可设置。

7.CCD对位机构:采用千分尺X-Y-Z精准调节,调焦便捷,精确。

8.X-Y轴机构:载台X-Y伺服控制,满足OGSFILM-TPGLASS-TP、液晶屏、电子纸等不同类型的产品在FOGFOBOLBPWB、等多位置邦定工艺中的需求。

1. Operating interface is convenient to set and indicate all kinds of parameter, such as platform moving speed, bonding time, vacuum value and area.

2. FPC fixture is adjusted by micrometer adjuster and with vacuum attaching function that can position fast.

3. Temperature controlling system guarantees the temperature accuracy.

4. Video segmentation meets requirement of different magnification times of image.

5. LED light controller can be adjusted as needed, suitable for imaging all sorts of things.
6. Adjusting group of pressure head is easy to operate, Collector of silicone rubber can roll automatically, rolling frequency and length can be set.

7. CCD aligning group adopt micrometer adjuster which is convenient to focus and with high accuracy.

8. Servo controlling of platform is suitable for multi station bonding of OGS, FILM-TP, GLASS-TP, LCD, EPD PANEL in FOG, FOB, OLB, PWB process.

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